wafer brightfield coax 2000
wafer brightfield coax 2000

Full-wafer Inspection Without Stitching

32k Line Scan Imaging For High-throughput Semiconductor Inspection

Reduced system complexity and reliable defect detection.

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Why 32K Matters In Wafer Production

Achieve higher resolution or larger inspection coverage without increasing camera count, optical complexity, or calibration effort.

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Higher Resolution At The Same Field Of View

Increase inspection precision from 20 µm to 10 µm resolution while maintaining the same field of view. Detect smaller defects without redesigning the optical setup.

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Larger Wafer Coverage Without Additional Cameras

Expand inspection coverage from 150 mm to 300 mm with a single 32K line scan camera. Enable seamless full-wafer imaging with fewer stitching zones.

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Reuse Existing 16K Optical Setups

Accelerate system upgrades without redesigning the complete optical architecture: Standard 16K optics remain compatible with the 32K camera platform.

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Reduce Multi-Camera System Complexity

Simplify system integration with a validated subsystem combining camera, optics, illumination, and frame grabber. Reduce engineering effort and accelerate deployment in semiconductor inspection environments.

 

Optimized For Semiconductor Production Environments

High-speed line scan imaging optimized for throughput, inspection consistency, and reflective wafer surfaces.

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Stable Inspection Consistency

Maintain consistent imaging performance across large wafer areas with seamless single-pass acquisition.

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Reliable Defect Visibility

Detect particles, scratches, and macro defects on reflective wafer surfaces with high-uniformity illumination.

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Inspection Throughput

Scan full wafers in under 10 seconds to support high-throughput semiconductor inspection workflows.

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