Full-wafer Inspection Without Stitching
32k Line Scan Imaging For High-throughput Semiconductor Inspection
Reduced system complexity and reliable defect detection.
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Why 32K Matters In Wafer Production
Achieve higher resolution or larger inspection coverage without increasing camera count, optical complexity, or calibration effort.
Higher Resolution At The Same Field Of View
Increase inspection precision from 20 µm to 10 µm resolution while maintaining the same field of view. Detect smaller defects without redesigning the optical setup.
Larger Wafer Coverage Without Additional Cameras
Expand inspection coverage from 150 mm to 300 mm with a single 32K line scan camera. Enable seamless full-wafer imaging with fewer stitching zones.
Reuse Existing 16K Optical Setups
Accelerate system upgrades without redesigning the complete optical architecture: Standard 16K optics remain compatible with the 32K camera platform.
Reduce Multi-Camera System Complexity
Simplify system integration with a validated subsystem combining camera, optics, illumination, and frame grabber. Reduce engineering effort and accelerate deployment in semiconductor inspection environments.
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