See Every Detail, At High Speed

Because in the semiconductor industry, “almost perfect” is simply not good enough.

Precision is everything in wafer manufacturing. As wafer structures become smaller and smaller and production lines run faster and faster, other imaging systems often reach their limits. Detecting macro defects (> 1 µm) on large wafers at high speed and with the right lighting has become one of the biggest challenges in quality assurance.

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Your Challenges

Detecting Tiny Defects Across Large Wafers

During wafer inspection, even the smallest particles or scratches must be reliably detected. At the same time, the inspection must cover entire 300 mm wafers, which requires high resolution over a large field of view.

Maintaining High Speed For 100% Inspection

Complete surface inspection must happen within tight cycle times. Slower inspection increases the risk of production bottlenecks and lower throughput.

Adapting Illumination To Different Defects Types And Surfaces

Different types of defects require different lighting techniques and colors to be clearly visible - all while maintaining sufficient light intensity for high-speed scanning.

Our Solution

High-resolution Line Scan Cameras With Up To 32k

Capture high-resolution images - with fewer cameras for the same field of view. This reduces costs and integration effort and detects even the smallest defects.

Semicon, Electronics & Display inspection

Sharp Results - Even At High Speeds

Perfectly synchronized line scan cameras capture the entire wafer in a single pass - for fast, high-quality inspection.

Flexible, High-intensity Illumination

Lighting systems with different characteristics and LED colors ensure optimum contrast for different types of defects - even at high speeds.

Application Examples: Flexible Inspection - Across All Wafer Process Steps

From bare wafers to final delivery, visual inspection is essential at every stage. These are typical areas of application where high-resolution imaging and customized lighting make all the difference.

Bare Wafer Inspection

Inspection of unprocessed wafers for particles, surface scratches, or contaminants before structuring begins.

Backside Wafer Inspection

Quality control of the wafer reverse side – important before processing or for double-sided wafers.

Macro Defect Detection

Detection of large-area defects such as coating irregularities, poor contacts, bridging, or missing structures.

Etch Process Monitoring

Inspection after the etching step to detect residues, corrosion, pinholes, or pattern defects.

CMP (Chemical Mechanical Polishing) Inspection

Surface quality control after polishing - checking for scratches, residues, or unpolished areas.

Outgoing Quality Control

Final visual check before wafers leave the fab - ensures cleanliness, coating integrity, and surface quality.

With 20+ years of semiconductor experience and our cutting-edge line scan technology, we've proven to be a trusted partner when it comes to pushing the limits of wafer inspection.

Our Recommendation

The allPIXA evo 16k and 32k combine high resolution and high speed to meet the demands of modern wafer inspection. With up to 16k for multi-field imaging and 32k for ultra-wide fields of view, both models deliver accurate results at high throughput.

Multi-field imaging enables image acquisition under different lighting conditions (e.g., bright field and dark field) in a single scan. Thanks to high line rates and the CoaXPress interface, both cameras support fast and reliable inspection with reduced system complexity. Whether for bare wafer inspection, CMP surface inspection, or macro defect detection, the allPIXA evo series ensures high-quality imaging across all critical process steps.